Integrated circuit having a doped porous dielectric and method of manufacturing the same

ABSTRACT

In one aspect of the invention, a method for forming an integrated circuit having an at least substantially doped porous dielectric includes forming a semiconductor device. The semiconductor device includes at least a portion of a semiconductor substrate. The method also includes forming a dielectric layer disposed outwardly from the semiconductor substrate and surrounding at least a portion of the semiconductor device. The dielectric layer includes an at least substantially porous dielectric material doped with at least one dopant. In addition, the method includes forming a contact layer disposed outwardly from the dielectric layer and operable to provide electrical connection to the semiconductor device.

This is a divisional application of Ser. No. 10/001,472 filed Nov. 1,2001 now U.S. Pat. 6,753,563 which is a non-provisional application ofprovisional application Ser. No. 60/251,494 filed Dec. 5, 2000.

TECHNICAL FIELD OF THE INVENTION

This invention relates to the field of electronic devices, and moreparticularly to an intergrated circuit having a doped porous dielectricand method of manufacturing the same.

BACKGROUND OF THE INVENTION

Integrated circuits typically contain a large number of semiconductordevices. Manufacturers of the integrated circuits often wish to decreasethe size of the integrated circuits, which allows more circuitry to beplaced within the same physical area of a circuit. To help decrease thesize of the integrated circuits, the manufacturers may place thesemiconductor devices closer together in the integrated circuits. Oneproblem is that capacitance between the semiconductor devices typicallyincreases as the space between the semiconductor devices decreases. Theincreased capacitance between the semiconductor devices can interferewith the operation of the semiconductor devices and with the operationof the integrated circuits.

One approach to decreasing the capacitance between the semiconductordevices involves decreasing the thickness of the semiconductor devices.For example, the manufacturers may reduce the thickness of gates used intransistors. The capacitance between the semiconductor devices istypically proportional to the cross-sectional area of the semiconductordevices. Because thinner semiconductor devices have less cross-sectionalarea, the capacitance between the semiconductor devices typicallydecreases. A problem with this approach is that difficulty may beencountered in maintaining the operation of the semiconductor devices.As the semiconductor devices become thinner, the reduced size of thedevices may interfere with the ability of the devices to conduct.Eventually, the reduced thickness of the semiconductor devices mayprevent the devices from conducting, and the semiconductor devices inthe integrated circuits can fail.

Another approach to decreasing the capacitance between the semiconductordevices involves lowering the dielectric constant (K) of the insulatingmaterial between the devices. For example, oxide may be used as aninsulating material in an integrated circuit, and oxide typically has adielectric constant of approximately four. The capacitance between thesemiconductor devices is typically proportional to the dielectricconstant of the insulating material. As a result, lowering thedielectric constant of the insulating material reduces the capacitancebetween the semiconductor devices. A problem with this approach is that,as manufacturers place the semiconductor devices closer together, thedielectric constant of the insulating material may still be high enoughto allow the formation of an appreciable amount of capacitance in theintegrated circuit. Also, the insulating material may suffer fromcontamination, such as by metal ions like sodium, that interferes withthe operation of the integrated circuit.

SUMMARY OF THE INVENTION

The present invention recognizes a need for an improved integratedcircuit having a doped porous dielectric and method of manufacturing thesame. The present invention reduces or eliminates at least some of theshortcomings of prior systems and methods.

In one embodiment of the invention, an integrated circuit includes asemiconductor device. The integrated circuit also includes a contactlayer disposed outwardly from the semiconductor device and operable toprovide electrical connection to the semiconductor device. In addition,the integrated circuit includes a dielectric layer disposed inwardlyfrom the contact layer and outwardly from the semiconductor device. Thedielectric layer comprises an at least substantially porous dielectricmaterial doped with at least one dopant.

In a particular embodiment of the invention, the semiconductor devicecomprises a transistor. Also, the dielectric layer may, for example,include an at least substantially porous dielectric material doped withat least one of phosphorus, fluorine, carbon, and boron.

In another embodiment of the invention, a method for forming anintegrated circuit having an at least substantially doped porousdielectric includes forming a semiconductor device. The semiconductordevice comprises at least a portion of a semiconductor substrate. Themethod also includes forming a dielectric layer disposed outwardly fromthe semiconductor substrate and surrounding at least a portion of thesemiconductor device. The dielectric layer comprises an at leastsubstantially porous dielectric material doped with at least one dopant.In addition, the method includes forming a contact layer disposedoutwardly from the dielectric layer and operable to provide electricalconnection to the semiconductor device.

Numerous technical advantages can be gained through various embodimentsof the invention. Various embodiments of the invention may exhibit none,some, or all of the following advantages. For example, in one embodimentof the invention, an integrated circuit is provided that uses a doped,at least substantially porous dielectric material disposed between asemiconductor device and a contact layer. The dielectric material may bedoped with any suitable dopant material, such as phosphorus andfluorine. The use of a fluorine dopant decreases the dielectric constantof the dielectric material, which helps to reduce the capacitancebetween different conductive regions in the integrated circuit. The useof phosphorus reduces the effects of metallic contamination in thedielectric material, which helps to reduce or eliminate interferencecaused by the contaminant in the integrated circuit.

Another technical advantage of at least some embodiments of theinvention is that the conductive regions in the semiconductor deviceretain an appropriate amount of thickness, helping to ensure that theintegrated circuit operates properly. The conductive regions in thesemiconductor device may retain enough thickness to conduct properly,which helps to ensure that the semiconductor device operates properly.The conductive regions need not be reduced in size to the point where itinterferes with the ability of the integrated circuit to function.

Other technical advantages are readily apparent to one of skill in theart from the attached figures, description, and claims.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present invention and theadvantages thereof, reference is now made to the following descriptionstaken in connection with the accompanying drawings, in which:

FIG. 1 is a cross-sectional view of an exemplary integrated circuitconstructed according to the teachings of the present invention; and

FIGS. 2 a-2 i illustrate an exemplary series of steps in the formationof an integrated circuit constructed according to the teachings of thepresent invention.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 is a cross-sectional view of an exemplary integrated circuit 10constructed according to the teachings of the present invention. In theillustrated embodiment, integrated circuit 10 includes a semiconductordevice 12, a dielectric layer 14 disposed outwardly from semiconductordevice 12, and a contact layer 16 disposed outwardly from semiconductordevice 12 and/or dielectric layer 14. Other embodiments of integratedcircuit 10 may be used without departing from the scope of the presentinvention.

In one aspect of the invention, dielectric layer 14 comprises an atleast substantially porous dielectric material 26. The dielectricmaterial 26 in dielectric layer 14 may be doped with at least onedopant. The dopants may include any suitable doping materials, such asat least one of phosphorus, fluorine, carbon, and boron. Fluorine may beuseful, for example, in reducing the dielectric constant of thedielectric material 26 in layer 14. Phosphorus may be useful, forexample, in reducing or eliminating the effects of contamination of thedielectric material 26 in dielectric layer 14.

In the illustrated embodiment, semiconductor device 12 comprises atransistor having a transistor gate 20 formed outwardly from asemiconductor substrate 18. A gate dielectric 19 may be formed outwardlyfrom semiconductor substrate 18 and inwardly from transistor gate 20.Other semiconductor devices 12 may be used in integrated circuit 10without departing from the scope of the present invention. In thisdocument, the phrase “semiconductor device” includes any structure orstructures formed integral with and/or outwardly from a semiconductorsubstrate 18. Semiconductor device 12 could, for example, include anystructure operable to perform various signal processing functions, suchas switching, gain introduction, attenuation, memory storage, and/orother processing functions.

Semiconductor substrate 18 may comprise any suitable semiconductorsubstrate material, such as silicon. In the illustrated embodiment,semiconductor substrate 18 includes a source region 22 and a drainregion 24.

Gate dielectric 19 is disposed outwardly from semiconductor substrate18. Gate dielectric 19 may be formed using any suitable material ormaterials, such as silicon dioxide or silicate, and may comprise one ormultiple layers.

Transistor gate 20 is disposed outwardly from semiconductor substrate 18and/or gate dielectric 19. When transistor gate 20 receives a thresholdvoltage, transistor gate 20 operates in an “on” state and conductsbetween source region 22 and drain region 24. When transistor gate 20receives less than a threshold voltage, transistor gate 20 operates inan “off” state and does not conduct between source region 22 and drainregion 24. Transistor gate 20 may be formed using any suitable materialor materials, such as polysilicon or metal, and may comprise one ormultiple layers.

In the illustrated embodiment, semiconductor device 12 also includes twoinsulators 28 a and 28 b. In this embodiment, insulators 28 isolatesource region 22 and drain region 24 from other portions ofsemiconductor substrate 18. For example, in one embodiment, multiplesemiconductor devices 12 may be formed in integrated circuit 10, eachhaving a source region 22 and a drain region 24. Insulators 28 mayisolate the source region 22 and drain region 24 of one transistor fromother source regions 22 and drain regions 24 of other transistors. Also,insulators 28 may define the area where source region 22 and drainregion 24 are formed during fabrication. For example, when source region22 and drain region 24 are being formed, insulators 28 may limit thearea of semiconductor substrate 18 in which the regions 22 and 24 areformed. Insulators 28 may comprise any suitable material or materialsoperable to isolate source region 22 and drain region 24 from otherportions of semiconductor substrate 18. In one embodiment, insulators 28comprise oxidized regions of semiconductor substrate 18.

Contact layer 16 is disposed outwardly from semiconductor substrate 18.Contact layer 16 provides electrical connection to the semiconductordevice 12. In the illustrated embodiment, contact layer 16 includes afirst contact 30 a and a second contact 30 b. First contact 30 a isdisposed proximate to source region 22, and second contact 30 b isdisposed proximate to drain region 24. Other embodiments of contactlayer 16 may be used without departing from the scope of the presentinvention. For example, in another embodiment, contact layer 16comprises short-length local interconnects.

Contacts 30 may be formed from any conductive material or combination ofconductive materials, such as copper, aluminum, tungsten, and/or dopedpolysilicon, and may comprise one or multiple layers. In one embodiment,to prevent contamination of other components of integrated circuit 10,each contact 30 may also comprise a barrier separating the conductivematerials in contact 30 from dielectric layer 14. This may be useful,for example, in preventing copper contamination of the dielectric layer14. In a particular embodiment, contacts 30 are separated fromdielectric material 26 by a tantalum nitride barrier. Other embodimentsof contacts 30 may be used without departing from the scope of thepresent invention.

Dielectric layer 14 is disposed outwardly from semiconductor device 12and inwardly from contact layer 16. In one embodiment, dielectric layer14 comprises an at least substantially porous dielectric material 26.Dielectric layer 14 may, for example, comprise one or multiple layers ofan at least substantially porous oxide, such as XLK spin-on dielectricof DOW CORNING CORPORATION, or NANOGLASS-E of HONEYWELL MICROELECTRONICSMATERIALS. Dielectric layer 14 may also comprise an at leastsubstantially porous organic dielectric material 26, such as porous SILKsemiconductor dielectric resin of DOW CHEMICAL COMPANY, or FLAREadvanced organic spin-on polymer of HONEYWELL MICROELECTRONIC MATERIALS.Dielectric layer 14 may comprise any other suitable dielectric material26 or combination of dielectric materials 26, and may comprise one ormultiple layers.

In one embodiment, dielectric layer 14 is doped with at least onedopant. Dielectric layer 14 may be doped with any suitable dopantmaterial, such as at least one of phosphorus, fluorine, carbon, andboron. The use of a fluorine dopant helps to decrease the dielectricconstant of the dielectric material 26, which helps to reduce thecapacitance between different conductive regions in integrated circuit10. The use of phosphorus helps to reduce the effects of metalliccontamination, such as by sodium, in the dielectric material 26, whichhelps to reduce or eliminate interference caused by the contaminant.

In the illustrated embodiment, integrated circuit 10 also includes anitride layer 32. Nitride layer 32 is useful, for example, in reducingor eliminating damage to semiconductor substrate 18 during the formationof contacts 30 and providing additional protection from contaminants.

Although FIG. 1 illustrates one embodiment of integrated circuit 10,other embodiments may be used without departing from the scope of thepresent invention. For example, integrated circuit 10 could include anytype of semiconductor device 12 and any number of semiconductor devices12. Also, semiconductor device 12 could be formed without the use ofinsulators 28. In addition, integrated circuit 10 could be formedwithout the use of nitride layer 32. Further, gate dielectric 19 may beremoved during the fabrication of semiconductor device 12.

FIGS. 2 a-2 i illustrate an exemplary series of steps in the formationof an integrated circuit 110 constructed according to the teachings ofthe present invention. Integrated circuit 110 includes a semiconductordevice 112, which in the illustrated embodiment comprises a transistor.Other embodiments of integrated circuit 110 may be used withoutdeparting from the scope of the present invention. For example,integrated circuit 110 could include any type of semiconductor device112 and any number of semiconductor devices 112.

In FIG. 2 a, a gate dielectric 119 and a transistor gate 120 are formedoutwardly from a semiconductor substrate 118. This may include, forexample, forming one or more layers of a nonconductive material ormaterials, such as silicon dioxide or silicate, outwardly fromsemiconductor substrate 118. This may also include depositing one ormore layers of a conductive material or materials, such as polysiliconor metal, outwardly from semiconductor substrate 118. This may furtherinclude forming transistor gate 120 from the deposited conductivematerial, such as by using a pattern and etch.

In FIG. 2 b, shallow and lightly doped source region 122 a and drainregion 124 a are formed in semiconductor substrate 118. This mayinclude, for example, forming the shallow, lightly doped source region122 a and drain region 124 a using any suitable fabrication method, suchas diffusion or ion implantation. In one embodiment, a sidewall oxide,nitride, or other suitable material or materials may be deposited ontransistor gate 120 to help offset source region 122 a and drain region124 a from gate 120.

In the illustrated embodiment, semiconductor device 112 includes twoinsulators 128 a and 128 b. Insulators 128 help to isolate source region122 a and drain region 124 a from other portions of semiconductorsubstrate 118. This may include isolating source region 122 a and drainregion 124 a from source and drain regions of other semiconductordevices 112. Insulators 128 also help to control the area in whichsource region 122 a and drain region 124 a are formed during thefabrication of semiconductor device 112. In another embodiment, sourceregion 122 a and drain region 124 a may be formed without the use ofinsulators 128.

In FIG. 2 c, a nitride layer 132 is formed outwardly from semiconductordevice 112. Nitride layer 132 provides an offset between transistor gate120 and deeper, more heavily doped source and drain regions insemiconductor substrate 118, which are illustrated in FIG. 2 d. Nitridelayer 132 may also be useful in reducing or eliminating damage tosemiconductor substrate 118 during later fabrication steps. Nitridelayer 132 may further be useful in protecting semiconductor device 112from contaminants. Nitride layer 132 may be formed using any suitablemethod, such as low-pressure chemical vapor deposition. Although FIG. 2c shows nitride layer 132 covering semiconductor device 112, nitridelayer 132 could also cover a portion of semiconductor device 112. Inanother embodiment, integrated circuit 110 may be formed without the useof nitride layer 132.

In FIG. 2 d, deeper and more heavily doped source region 122 b and drainregion 124 b are formed in semiconductor substrate 118. This mayinclude, for example, forming the deeper, more heavily doped sourceregion 122 b and drain region 124 b using any suitable fabricationmethod, such as diffusion or ion implantation. Nitride layer 132 mayoffset the source region 122 b and drain region 124 b from transistorgate 120. Insulators 128 also help to isolate source region 122 b anddrain region 124 b from other portions of semiconductor substrate 118.In the remainder of this description, source regions 122 a and 122 b maybe identified collectively as source region 122, and drain regions 124 aand 124 b may be identified collectively as drain region 124.

In FIG. 2 e, a dielectric layer 114 is formed outwardly fromsemiconductor substrate 118. Dielectric layer 114 includes one or moreat least substantially porous dielectric materials 126. Dielectric layer114 may also include one or multiple layers of dielectric material ormaterials 126.

Dielectric layer 114 may be formed using any suitable fabricationmethod. In one embodiment, dielectric layer 114 is formed using aspin-on fabrication method by depositing a liquid precursor containingthe dielectric material 126 on integrated circuit 110. Dielectric layer114 could also be formed using a chemical vapor deposition method byplacing integrated circuit 110 in a chamber containing at least one gas,where energy is applied to promote chemical reactions that formdielectric material 126.

In FIG. 2 f, one or more doping layers 134 are disposed outwardly fromdielectric layer 114. Doping layer 134 contains at least one dopant.Doping layer 134 may, for example, comprise fluorine silicon glass orphosphorus silicon glass. Doping layer 134 may be formed using anysuitable method, such as spin-on or chemical vapor depositiontechniques.

After forming doping layer 134, doping layer 134 and dielectric layer114 are annealed at one or more temperatures. By annealing the dopinglayer 134 and the dielectric layer 114, dielectric layer 114 may bedoped with the dopant contained in the doping layer 134. In oneembodiment, dielectric layer 114 is doped using a two-step anneal. In aparticular embodiment, at least one doping layer 134 contains aphosphorus dopant. The integrated circuit 110 is annealed at onetemperature to dope the dielectric layer 114 with the phosphorus dopantcontained in doping layer 134. If needed, the dielectric layer 114 maythen be annealed again to activate the phosphorus.

Although FIG. 2 f illustrates one doping layer 134 disposed outwardlyfrom dielectric layer 114, multiple doping layers 134 may be usedwithout departing from the scope of the present invention. For example,two doping layers 134, one containing a phosphorus dopant and onecontaining a fluorine dopant, may be used to dope dielectric layer 114.Also, after annealing the doping layer 134, doping layer 134 may or maynot be removed from the integrated circuit 110.

In FIG. 2 g, cavities 136 a and 136 b are formed in dielectric layer114, nitride layer 132, and gate dielectric 119. Cavities 136 may beformed using any suitable fabrication process, such as a pattern andetch. In the illustrated embodiment, cavities 136 are formed toapproximately conform to the shape of contacts 130. In anotherembodiment, cavities 136 may be formed to approximately conform to othershapes, such as the shape of short-length local interconnects.

In one embodiment, at least two etches are used to form cavities 136. Afirst etch is used to form cavities 136 in the dielectric material 126in dielectric layer 114. The first etch forms cavities 136 throughdielectric material 126 until it reaches nitride layer 132. After that,a second etch, such as a nitride etch, is used to etch through nitridelayer 132. This may help to reduce or eliminate damage to semiconductorsubstrate 118 during the etching process. In another embodiment, atleast one other etch may also be used to etch through one or more dopinglayers 134 shown in FIG. 2 f and/or gate dielectric 119.

In FIG. 2 h, a conductive material 138 is disposed outwardly fromsemiconductor substrate 118 in cavities 136. Conductive material 138 maybe deposited on integrated circuit 110 using any suitable method, suchas physical vapor deposition, chemical vapor deposition, orelectrochemical deposition techniques. Conductive material 138 maycomprise any conductive material or combination of conductive materials,including aluminum, tungsten, copper, and/or doped polysilicon.Conductive material 138 may further have one or multiple layers ofconductive material or materials 138.

In one embodiment, conductive material 138 comprises copper. To preventcopper contamination of other components of integrated circuit 110, abarrier is formed between conductive material 138 and dielectricmaterial 126. The barrier may be formed, for example, before theconductive material 138 is deposited on integrated circuit 110. Thebarrier helps to reduce or eliminate the contamination of the dielectricmaterial 126 by the copper. In one embodiment, the barrier comprises atantalum nitride barrier.

In FIG. 2 i, conductive material 138 formed into contacts 130 a and 130b is delineated using any suitable method, such as a pattern and etch.

Although FIGS. 2 a-2 i illustrate one particular example of a method offorming integrated circuit 110, integrated circuit 110 could also beformed using a wide variety of methods. For example, transistor gate 120could be formed after the formation of source region 122 and drainregion 124. Also, integrated circuit 110 may be formed without the useof insulators 128 and/or nitride layer 132.

In addition, FIGS. 2 e and 2 f illustrate the use of one or more dopinglayers 134 to dope dielectric layer 114. Other methods of forming adoped dielectric layer 114 may be used without departing from the scopeof the present invention. For example, in another embodiment, an undopeddielectric layer 114 may be placed in a chamber and exposed to at leastone gas containing the dopant. Applying heat and/or pressure in thechamber, dielectric layer 114 may be doped with the dopant contained inthe gas.

In yet another embodiment, dielectric layer 114 could be formed inintegrated circuit 110 already containing the dopant. Dielectric layer114 could, for example, be formed using a spin-on technique, where theliquid precursor contains the dielectric material 126 and the dopant.Dielectric layer 114 could also be formed using chemical vapordeposition, where the at least one gas in the chamber contains thedopant and the constituents of the dielectric material 126. Theconstituents of the dielectric material 126 react to form dielectricmaterial 126.

Although the present invention has been described in severalembodiments, a myriad of changes, variations, alterations,transformations, and modifications may be suggested to one skilled inthe art, and it is intended that the present invention encompass suchchanges, variations, alterations, transformations, and modifications asfall within the spirit and scope of the appended claims.

1. A method for forming an integrated circuit having an at leastsubstantially doped porous dielectric, comprising: forming asemiconductor device comprising a transistor gate, the semiconductordevice comprising at least a portion of a semiconductor substrate;forming a nitride layer over the semiconductor device including over thetransistor gate; forming a dielectric layer disposed over thesemiconductor substrate and nitride layer and laterally surrounding atleast a portion of the transistor gate, the dielectric layer comprisingan at least substantially porous dielectric material doped with at leastone dopant; and forming a contact layer over the dielectric layer. 2.The method of claim 1, wherein the dopant comprises at least one ofphosphorus, fluorine, carbon, and boron.
 3. The method of claim 1,wherein the at least substantially porous dielectric material comprisesan at least substantially porous oxide.
 4. The method of claim 1,wherein forming a dielectric layer comprises: forming an undoped atleast substantially porous dielectric layer over the semiconductorsubstrate and laterally surrounding at least a portion of the transistorgate; and doping the dielectric layer with the at least one dopant. 5.The method of claim 4, wherein doping the dielectric layer with the atleast one dopant comprises: forming at least one doping layer over thedielectric layer, the at least one doping layer comprising the at leastone dopant; and annealing the at least one doping layer and thedielectric layer.
 6. The method of claim 4, wherein doping thedielectric layer comprises exposing the dielectric layer to at least onegas comprising the at least one dopant.
 7. The method of claim 1,wherein forming a dielectric layer comprises depositing a liquidprecursor around at least a portion of the semiconductor device, theliquid precursor comprising the dielectric material and the at least onedopant.
 8. The method of claim 1, wherein forming a dielectric layercomprises forming the dielectric layer using at least one gas comprisingconstituents of the dielectric material and the at least one dopant. 9.The method of claim 1, wherein forming a semiconductor device comprises:forming a source region in the semiconductor substrate; and forming adrain region in the semiconductor substrate, wherein the transistor gateis located between the source region and the drain region.
 10. Themethod of claim 9, wherein said depositing step comprises a spin-ondeposition process.
 11. A method for forming an integrated circuithaving an at least substantially doped porous dielectric comprising:forming a semiconductor device comprising a transistor gate, thesemiconductor device comprising at least a portion of a semiconductorsubstrate; depositing an at least substantially porous dielectricmaterial over the semiconductor substrate and laterally surrounding atleast a portion of the transistor gate; incorporating a dopant into theat least substantially porous dielectric material; and forming a contactlayer over the dielectric layer; wherein said incorporating stepcomprises: forming at least one doping layer over the at leastsubstantially porous dielectric material, the at least one doping layercomprising the at least one dopant; and annealing the at least onedoping layer and the at least substantially porous dielectric material.